SPRUJF1A November   2024  – May 2025 AM2612

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
      1. 1.1.1 Preface: Read This First
        1. 1.1.1.1 Sitara MCU+ Academy
        2. 1.1.1.2 Important Usage Notes
    2. 1.2 Kit Contents
    3. 1.3 Device Information
      1. 1.3.1 System Architecture Overview
      2. 1.3.2 Component Identification
      3. 1.3.3 Functional Block Diagram
      4. 1.3.4 BoosterPacks
      5. 1.3.5 Device Information
        1. 1.3.5.1 Security
  7. 2Hardware
    1. 2.1  Setup
      1. 2.1.1 Standalone Configuration
      2. 2.1.2 Ethernet Application Configuration
    2. 2.2  Power Requirements
      1. 2.2.1 Power Input Using USB Type-C Connector
      2. 2.2.2 Power Tree
      3. 2.2.3 Power Status LEDs
    3. 2.3  Header Information
      1. 2.3.1 OSPI Expansion Connector
      2. 2.3.2 ADC/DAC External VREF Headers
      3. 2.3.3 Ethernet Add-on Board Connectors
      4. 2.3.4 FSI Header
      5. 2.3.5 EQEP Headers
    4. 2.4  Push Buttons
    5. 2.5  Reset
    6. 2.6  Clock
    7. 2.7  Boot Mode Selection
    8. 2.8  GPIO Mapping
    9. 2.9  IO Expander
    10. 2.10 Interfaces
      1. 2.10.1  Memory Interfaces
        1. 2.10.1.1 OSPI
        2. 2.10.1.2 Board ID EEPROM
      2. 2.10.2  Ethernet Interface
        1. 2.10.2.1 Ethernet PHY Add-on Board Connector #0 - CPSW RGMII/ICSSM
        2. 2.10.2.2 Ethernet PHY Add-on Board Connector #1 - CPSW RGMII/ICSSM
      3. 2.10.3  I2C
        1. 2.10.3.1 Industrial Application LEDs
      4. 2.10.4  SPI
      5. 2.10.5  UART
      6. 2.10.6  MCAN
      7. 2.10.7  FSI
      8. 2.10.8  JTAG
      9. 2.10.9  Test Automation Pin Mapping
      10. 2.10.10 LIN
      11. 2.10.11 ADC and DAC
      12. 2.10.12 EQEP
      13. 2.10.13 EPWM
      14. 2.10.14 USB
    11. 2.11 BoosterPack Headers
      1. 2.11.1 BoosterPack Mode 00: Standard LaunchPad/BoosterPack Pinout
      2. 2.11.2 BoosterPack Mode 01: BP-AM2BLDCSERVO Mode
      3. 2.11.3 BoosterPack Mode 10: BOOSTXL-IOLINKM-8 Mode
      4. 2.11.4 BoosterPack Mode 11: C2000 DRVx BoosterPacks Mode
    12. 2.12 Pinmux Mapping
    13. 2.13 Test Points
    14. 2.14 Best Practices
  8. 3Software
  9. 4Hardware Design Files
  10. 5Compliance
  11. 6Additional Information
    1. 6.1 Revision E1 Modifications
      1. 6.1.1 TA_POWERDOWNz pulled up by VSYS_TA_3V3 which is powered by VSYS_3V3
      2. 6.1.2 USB2.0_MUX_SEL0 pulled up by R355
      3. 6.1.3 MDIO and MDC of PRU0-ICSS0 needs to be routed to both Ethernet PHYs
      4. 6.1.4 AM261_RGMII1_RXLINK and AM261_RGMII2_RXLINK to be connected to GPIO
    2. 6.2 Revision E2 Changes from E1
    3. 6.3 Revision E2 Known Limitations
    4.     Trademarks
  12. 7References
    1. 7.1 Reference Documents
    2. 7.2 Other TI Components Used in This Design
  13. 8Revision History

1.3.4 BoosterPacks

The AM261x LaunchPad development kit provides an easy and inexpensive way to develop applications with the AM261x Series microcontroller. BoosterPacks are add-on boards that follow a pin-out standard created by Texas Instruments. The TI and third-party ecosystem of BoosterPacks greatly expands the peripherals and potential applications that you can easily explore with the AM261x LaunchPad. For a detailed look at the pinout of the AM261x LaunchPad BoosterPack headers, refer to Section 2.12.

You can also build your own BoosterPack by following the design guidelines on TI’s website. Texas Instruments even helps you promote your BoosterPack to other members of the community. TI offers a variety of avenues for you to reach potential customers with your solutions.
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